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IC Packaging Engineering Lead/Manager

Company: Apple US Corp
Location: Cupertino
Posted on: May 3, 2021

Job Description:

SummarySummaryPosted: Jun 17, 2020 Role Number:200176166Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish!We are looking for a hardworking, talented and passionate IC Packaging Engineering Lead to join our team.Key Qualifications5+ years of experience in Semiconductor Packaging Design, Process & Technology DevelopmentGood understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FAExpert in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraintsExcellent problem solving with strong physics and fundamentalsExcellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliersCross-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and costAbility to work independently and take on projects with minimum supervisionDescriptionWork with cross-functional teams and lead package integration and architecture effortsWork with 3rd party and OSAT to bring packaging solution from concept to HVMDrive industry with advanced package solutions and specs ~10% International travelEducation & ExperiencePh.D. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science or Physics required and relevant experience within technical discipline.Additional Requirements

Keywords: Apple US Corp, Cupertino , IC Packaging Engineering Lead/Manager, Other , Cupertino, California

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